Oracle SPARC T5-4 - Servicing the Front I;O Assembly; Front I;O Assembly Reference; Remove the Front I;O Assembly

Servicing the Front I/O Assembly 131
Servicing the Front I/O Assembly
These topics describe service procedures for the front I/O assembly in the server.
Caution - This procedure requires that you handle components that are sensitive to electrostatic
discharge. This discharge can cause failure of server components.
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“Front I/O Assembly Reference” on page 131
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“Remove the Front I/O Assembly” on page 131
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“Install the Front I/O Assembly” on page 133
Front I/O Assembly Reference
The front I/O assembly consists of the following components:
■
Two circuit boards (FIO and VGA boards)
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A ribbon cable connecting the front I/O assembly to the motherboard
Related Information
■
“Remove the Front I/O Assembly” on page 131
■
“Install the Front I/O Assembly” on page 133
Remove the Front I/O Assembly
The front I/O assembly is a cold-service component that can be replaced only by
authorized service personnel. For the location of this component, see “Main Module
Components” on page 19.
Caution - This procedure requires that you handle components that are sensitive to electrostatic
discharge. This discharge can cause electronic components to fail.