8
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
9.2 IDE Interface.....................................................................................................................194
9.2.1 Cabling.................................................................................................................194
9.3 Cable Detection for Ultra ATA/66 and Ultra ATA/100.......................................................195
9.3.1 Combination Host-Side/Device-Side Cable Detection.........................................195
9.3.2 Device-Side Cable Detection...............................................................................196
9.3.3 Primary IDE Connector Requirements ................................................................198
9.3.4 Secondary IDE Connector Requirements............................................................199
9.4 AC’97................................................................................................................................200
9.4.1 AC’97 Routing......................................................................................................203
9.4.2 Motherboard Implementation...............................................................................204
9.4.2.1 Valid Codec Configurations .................................................................205
9.4.3 SPKR Pin Consideration......................................................................................205
9.4.4 AC_SDOUT Pin Consideration............................................................................206
9.4.5 SIU0_DTR# Pin Consideration............................................................................206
9.5 Communication Network Riser.........................................................................................206
9.5.1 AC’97 Audio Codec Detect Circuit and Configuration Options............................207
9.5.1.1 CNR 1.2 AC’97 Disable and Demotion Rules for the Motherboard .....207
9.5.2 CNR Routing Summary.......................................................................................209
9.6 USB 2.0 ............................................................................................................................210
9.6.1 Layout Guidelines................................................................................................210
9.6.1.1 General Routing and Placement..........................................................210
9.6.1.2 USB 2.0 Trace Separation...................................................................211
9.6.1.3 USB BIAS Connections .......................................................................211
9.6.1.4 USB 2.0 Termination............................................................................212
9.6.1.5 USB 2.0 Trace Length Pair Matching ..................................................212
9.6.1.6 USB 2.0 Trace Length Guidelines .......................................................212
9.6.2 Plane Splits, Voids and Cut-Outs (Anti-Etch) ......................................................213
9.6.2.1 VCC Plane Splits, Voids, and Cut-Outs (Anti-Etch).............................213
9.6.2.2 GND Plane Splits, Voids, and Cut-Outs (Anti-Etch).............................214
9.6.3 USB Power Line Layout Topology.......................................................................214
9.6.4 EMI Considerations .............................................................................................214
9.6.4.1 Common-Mode Chokes.......................................................................215
9.6.5 ESD .....................................................................................................................215
9.6.6 Front Panel Solutions ..........................................................................................216
9.6.6.1 Internal USB Cables ............................................................................216
9.6.6.2 Motherboard/PCB Mating Connector...................................................217
9.6.6.3 Front Panel Connector Card................................................................218
9.7 Low Pin Count (LPC) Interface.........................................................................................219
9.7.1 General Routing and Placement..........................................................................220
9.7.2 LPC Trace Length Matching................................................................................220
9.7.3 LPC Interface Routing Guidelines .......................................................................220
9.8 SMBus 2.0/SMLink Interface............................................................................................221
9.8.1 SMBus Architecture & Design Considerations ....................................................222
9.8.1.1 SMBus Design Considerations. ...........................................................222
9.8.1.2 General Design Issues / Notes ............................................................222
9.8.1.3 High Power/Low Power Mixed Architecture.........................................223
9.8.1.4 Calculating the Physical Segment Pull-Up Resistor ............................223
9.9 PCI....................................................................................................................................224
9.9.1 PCI Routing Summary.........................................................................................224
9.9.2 PIRQ Routing Example........................................................................................227
9.10 PCI-X Design Guidelines..................................................................................................228