Technical specifications
Table 1.  Technical specifications
Specification Description
Dimension
•  2U
•  Height: 86.5 mm (3.4 inches)
•  Width: 
–  With rack latches: 482.1 mm (19.0 inches)
–  Without rack latches: 445.0 mm (17.5 inches)
•  Depth: 763.7 mm (30.1 inches)
Note: The depth is measured with rack latches installed, but without the security bezel 
installed.
Weight Up to 38.8 kg (85.5 lb), depending on the server configuration
Processor (depending 
on the model)
•  Up to two 3rd Gen Intel Xeon scalable processors
•  Designed for Land Grid Array (LGA) 4189 socket
•  Up to 40 cores per socket
•  Supports 3 Intel Ultra Path Interconnect (UPI) links at 11.2 GT/s
•  Thermal Design Power (TDP): up to 270 watts
For a list of supported processors, see 
https://static.lenovo.com/us/en/serverproven/ 
index.shtml
.
Memory
•  Slots: 32 memory module slots
Supports up to 16 Intel Optane Persistent Memory (PMEM) modules
•  Supported memory module type: 
–  TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
–  TruDDR4 3200, quad-rank, 128 GB 3DS RDIMM
–  TruDDR4 3200, 128 GB/256 GB PMEM
•  Minimum memory:  
–  16 GB using RDIMMs
–  128 GB using 3DS RDIMMs
•  Maximum memory: 
–  Without PMEMs: 
–  2 TB using RDIMMs
–  4 TB using 3DS RDIMMs
–  With PMEMs: 
–  5 TB using both RDIMMs and PMEMs in Memory Mode
–  6 TB using both 3DS RDIMMs and PMEMs in App Direct Mode
Note: The operating speed and total memory capacity depend on the processor model and 
UEFI settings.
For a list of supported memory options, see 
https://static.lenovo.com/us/en/serverproven/ 
index.shtml
.
Chapter 1. ThinkSystem SR650 V2 (7Z72 and 7Z73) 3