Figure 224. Separating a processor carrier the from heat sink
Note: The processor carrier will be discarded and replaced with a new one.
a. Release the retaining clips from the heat sink.
b. Lift the carrier from the heat sink.
c. Wipe the thermal grease from the bottom of the heat sink with an alcohol cleaning pad.
After you finish
If you are instructed to return the defective component, please package the part to prevent any shipping
damage. Reuse the packaging the new part arrived in and follow all packaging instructions.
Install a processor and heat sink
This task has instructions for installing an assembled processor and heat sink, known as a processor-heat-
sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained
technician.
About this task
Attention:
• Read “Installation Guidelines” on page 185 to ensure that you work safely.
• Power off the server and disconnect all power cords for this task.
• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-
sensitive components in their static-protective packages until installation, and handling these devices with
an electrostatic-discharge wrist strap or other grounding system.
• Each processor socket must always contain a cover or a PHM. When removing or installing a PHM,
protect empty processor sockets with a cover.
• Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and
easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause
connection failures.
• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact
with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage
components, such as the electrical connectors in the processor socket.
• Remove and install only one PHM at a time. If the system board supports multiple processors, install the
PHMs starting with the first processor socket.
Chapter 4. Hardware replacement procedures 301
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