iSeries Model 825 211
Draft Document for Review October 18, 2004 5486M825.fm
#3042 - 256 MB Main Storage DIMM DDR - 128 Mb Technology (Unstacked)
#3043 - 512 MB Main Storage DIMM DDR - 256 Mb Technology (Unstacked)
#3044 - 1024 MB Main Storage DIMM DDR - 256 Mb Technology (Stacked)
#3046 - 2048 MB Main Storage DIMM DDR - 512 Mb Technology (Stacked)
For the Model 825, the main storage Dual Inline Memory Modules (DIMMs) are
installed directly onto the processor cards. Each processor card has eight DIMM
slots. The eight slots are arranged in two sets of four. The DIMMs must be
installed in sets of four (quads). Each set of four DIMMs must be the same
memory capacity and technology. Each system order must have at least one set
of three main storage DIMM quads (12 DIMMs total) installed. An exception is
the 2 GB memory capacity point, where two quads (eight DIMMs total) are
allowed.
Three processor cards (three multichip modules (MCMs)) are installed in the
Model 825 system. There is a total of 24 DIMM slots, in which 8, 12, 16, 20, or 24
memory DIMMs may be installed.
The following main storage requirements apply:
The marketing configurator defaults to 3 GB of memory. If 2 GB of total main
storage is specified, a message is issued indicating this memory configuration
is not recommended by IBM.
Except on systems with 2 GB of memory capacity, no Single Chip Model
(SCM) board is allowed to contain more than twice the memory capacity of
any other processor.
The marketing configurator determines the correct number and combination of
memory features to fulfill a chosen increment. It is based on the minimum
number of memory features required to meet the increment within the
requirements of one quad per SCM board. No SCM board having more than two
times the total memory of any other SCM board is allowed.
9406 Model 825 schematics
The following diagrams show the slot and feature card arrangement of the Model
825 system unit, base enclosure, and rack. You can find schematics of any
supported expansion units in Chapter 15, “Towers, racks, and high-speed link” on
page 259.
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