5–25
Transpector CPM Operating Manual
WOF
4
may be the only indication that water vapor or oxygen are also present, but
not detected by the mass spectrometer because of rapid reaction with the tungsten
hexafluoride.
5.3.1.7 Copper MOCVD
Table 5-7 lists some of the materials of interest and the masses for monitoring them
for the deposition of copper using Cu
I
(hfac)(tmvs). Oxygen and water vapor are
unwanted contaminants.
Table 5-6 Tungsten CVD materials of interest
Chemical Type Monitoring Mass
WF6 reagent 279
H2 reagent 2
SiH4 reagent 30, 31, 32
Ar reagent 40
N2 reagent 28
(interference from SiH4)
HF product 20 (at 35 eV)
O2 contaminant 32
(interference from SiH4)
H2O contaminant 18 (at 35 eV)
WOF4 by-product 257
Table 5-7 Copper MOCVD materials of interest
Chemical Types Monitoring Mass
CuI(hfac)(tmvs) reagent 201, 63
H2 reagent 2
Ar reagent 40
tmvs product 100, 85
H(hfac) product 139
O2 contaminant 32
H2O contaminant 18
(if Ar present, use 35 eV)
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