6–1
Transpector CPM Operating Manual
Chapter 6
Operation
6.1 HexBlock
The HexBlock provides several inlets, a process pressure gauge (CDG) and a
calibration reference. It allows for up to three pressure ranges, including a high
conductance inlet that covers various applications such as High Density Plasma
Etch (HDP), TiN Deposition such as TDMAT, W CVD, or any other semiconductor
process. Advantages include:
small vacuum path lengths
minimum surface area
interchangeable orifices
multiple process connection options (CF40, KF40 and KF25)
multiple sniffer (capillary) inlet options for sampling the process
The orifices mounted in the HexBlock valves are replaceable.
Pressure ranges for the two main sampling valves are:
V1 . . . 3 mTorr–10 Torr
V2 . . . 3 mTorr–Atmosphere
The tool and the CPM must be vented before changing
orifices, except when a tool isolation valve is installed.
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