Intel 855GME User Manual

5
Intel
®
855GME Chipset and Intel
®
6300ESB ICH Embedded Platform Design Guide
4.4.1 Transient Response...............................................................................................90
4.4.2 High-Frequency/Mid-Frequency and Bulk Decoupling Capacitors ........................91
4.4.3 Processor Core Voltage Plane and Decoupling.....................................................91
4.4.4 Processor and GMCH VCCP Voltage Plane and Decoupling .............................100
4.4.5 GMCH Core Voltage Plane and Decoupling........................................................101
4.5 Power and Sleep State Definitions ...................................................................................101
4.6 Power Delivery Map..........................................................................................................103
4.7 Intel 855GME Chipset Platform Power-Up Sequence......................................................105
4.7.1 GMCH Power Sequencing Requirements ...........................................................105
4.7.2 6300ESB Power Sequencing Requirements .......................................................105
4.7.2.1 V5REF/3.3V Sequencing.....................................................................105
4.7.2.2 3.3V/1.5V Power Sequencing ..............................................................106
4.7.3 PCI-X Power Sequencing ....................................................................................106
4.7.4 DDR Memory Power Sequencing Requirements.................................................106
4.8 Intel 855GME Chipset Platform Power Delivery Guidelines.............................................107
4.8.1 Intel 855GME Chipset and Decoupling Guidelines..............................................108
4.8.1.1 GMCH VCCSM Decoupling.................................................................108
4.8.1.2 DDR SDRAM VDD Decoupling............................................................109
4.8.1.3 DDR VTT Decoupling Placement and Layout Guidelines....................109
4.8.2 DDR Memory Power Delivery Design Guidelines................................................109
4.8.2.1 2.5 V Power Delivery Guidelines .........................................................110
4.8.2.2 GMCH and DDR SMVREF Design Recommendations .......................111
4.8.2.3 DDR SMRCOMP Resistive Compensation..........................................111
4.8.2.4 DDR VTT Termination .........................................................................112
4.8.2.5 DDR SMRCOMP and VTT 1.25 V Supply Disable in S3/Suspend......112
4.8.3 Other GMCH Reference Voltage and Analog Power Delivery.............................113
4.8.3.1 GMCH GTLVREF ................................................................................113
4.8.3.2 GMCH AGTL+ I/O Buffer Compensation.............................................115
4.8.3.3 GMCH AGTL+ Reference Voltage.......................................................115
4.8.3.4 GMCH Analog Power...........................................................................116
4.8.4 Intel
®
6300ESB Power Delivery...........................................................................118
4.8.5 Power Supply PS_ON Consideration ..................................................................119
4.8.6 Intel
®
6300ESB Analog Power Delivery ..............................................................120
4.8.7 Intel
®
6300ESB Standby Power Distribution .......................................................120
4.8.8 Intel® 6300ESB Power Consumption..................................................................120
4.8.9 Intel
®
6300ESB Decoupling Recommendations..................................................120
4.8.10 6300ESB Power Signal Decoupling ...................................................................121
4.8.11 Hub Interface Decoupling ....................................................................................121
4.8.12 FWH Decoupling..................................................................................................121
4.9 Thermal Design Power .....................................................................................................121
5 System Memory Design Guidelines (DDR-SDRAM) ...............................................................123
5.1 Introduction .......................................................................................................................123
5.2 Length Matching and Length Formulas ............................................................................124
5.3 Package Length Compensation........................................................................................124
5.4 Topologies and Routing Guidelines..................................................................................125
5.4.1 Clock Signals – SCK[5:0], SCK[5:0]# ..................................................................125
5.4.2 Clock Topology Diagram .....................................................................................125
5.4.3 DDR Clock Routing Guidelines............................................................................126
5.4.3.1 Clock Length Matching Requirements .................................................127
5.4.3.2 Clock Reference Lengths.....................................................................128

Intel 855GME Specifications

General

Brand	Intel
Model	855GME
Category	Computer Hardware
Language	English