Models 2500 and 2502 User’s Manual SCPI Command Reference 17-37
FAIL:SOURce3 <NRf> | <NDN>
:CALCulate7:CLIMits:FAIL:SOURce3 <NRf> | <NDN> Specify fail pattern
Parameters <NRf> = 0 to 7 (3-bit) Decimal value
0 to 15 (4-bit) Decimal value
<NDN> = 0 to #b111 (3-bit) Binary value
0 to #b1111 (4-bit) Binary value
0 to #q7 (3-bit) Octal value
0 to #q17 (4-bit) Octal value
0 to #h7 (3-bit) Hexadecimal value
0 to #hF (4-bit) Hexadecimal value
Query :SOURce3? Query programmed source value
Description For the sorting mode, this command is used to define the 3-bit or 4-bit
output pattern for the digital I/O port when there are any limit test fail-
ures. Note that the output value can be specified using binary, octal, dec-
imal, or hexadecimal format. Use the table provided in “SOURce3
<NRf> | <NDN>,” “Description,” page 17-34, to determine the decimal
parameter value for the desired digital output pattern.
BCONtrol <name>
:CALCulate7:CLIMits:BCONtrol <name> Control digital I/O port pass/fail update
Parameters <name> = IMMediate Update output when first failure occurs
END Update output after sweep is completed
Query :BCONtrol? Query when digital output will update
Description This command is used to control when the digital output will update to
the pass or fail bit pattern. The pass or fail bit pattern tells the handler to
stop the testing process and place the DUT in the appropriate bin.
With IMMediate selected, the digital output will update immediately to
the bit pattern for the first failure in the testing process. If all the tests
pass, the output will update to the pass bit pattern.
With END selected, the digital output will not update to the pass or fail
bit pattern until the Model 2500 completes the sweep or list operation.
This allows multiple test cycles to be performed on DUT. With the use
of a scanner card, multi-element devices can be tested. If, for example,
you did not use END and the first element in the device package passed,
the pass bit pattern will be output. The testing process will stop and the
DUT will be binned. As a consequence, the other elements in the device
package are not tested.
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