Lenovo ThinkSystem SR650 V2 - Page 204

Server models with middle/rear drive bays
This section provides thermal information for server models with middle or rear drive bays.
S/S: SAS/SATA; Any: AnyBay
Front bays Middle
bays
Rear bays
CPU
TDP*
(watts)
Max.
Ambient
Temp.
(at sea
level)
Heat sink Air
baffle
Fan type Max.
PMEM
Qty.
24 x 2.5" S/S
16 x 2.5" S/S +
8 x Any
NA 4 x 2.5" S/S <= 205 30°C
Standard
2U
Stand-
ard
Perform-
ance
16
24 x 2.5" Any 8 x 2.5" Any
NA
105–150 30°C
Standard
1U
None
Perform-
ance
16
165–205 30°C
Perform-
ance (T-
shape)
None
Perform-
ance
16
24 x 2.5" S/S 8 x 2.5" S/S
4 x 2.5" S/S
8 x 2.5" S/S
105–150 30°C
Standard
1U
None
Perform-
ance
16
165–205 30°C
Perform-
ance (T-
shape)
None
Perform-
ance
16
12 x 3.5" S/S
NA
2 x 3.5" S/S
4 x 2.5" S/S
4 x 3.5" S/S
<= 205 30°C
Standard
2U
Stand-
ard
Perform-
ance
4
8 x 2.5" Any
NA
105–150 30°C
Standard
1U
None
Perform-
ance
4
165–205 30°C
Perform-
ance (T-
shape)
None
Perform-
ance
4
4 x 3.5" S/S
4 x 2.5" S/S
4 x 3.5" S/S
105–150 30°C
Standard
1U
None
Perform-
ance
4
165–205 30°C
Perform-
ance (T-
shape)
None
Perform-
ance
4
12 x 3.5" Any
NA 4 x 3.5" S/S <= 205 30°C
Standard
2U
Stand-
ard
Perform-
ance
4
4 x 3.5" S/S 4 x 3.5" S/S
105–150 30°C
Standard
1U
None
Perform-
ance
4
165–205 30°C
Perform-
ance (T-
shape)
None
Perform-
ance
4
Note: *The Intel Xeon 6334 HCC 165W processor is not included. When this processor is used, middle drive
bays or rear drive bays are not supported.
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ThinkSystem SR650 V2Maintenance Manual