Lenovo ThinkSystem SR650 V2 - Page 205

Server models with GPUs
This section provides thermal information for server models with GPUs.
Front
bays
CPU TDP*
(watts)
Max.
Ambient
Temp. (at
sea level)
Heat sink Air baffle Fan type
Max. GPU Qty.
Max.
PMEM
Qty.
40W/
75W
150W
250W/
300W
8 x 2.5"
16 x 2.5"
8 x 3.5"
<= 205
1
30°C
Standard
2U
Standard
Perform-
ance
8 16
Standard
1U
GPU
Perform-
ance
4 16
3 16
220–270 30°C
Perform-
ance (T-
shape)
Standard Perform-
ance
8 16
GPU
Perform-
ance
4 16
3 16
24 x 2.5"
105–150 30°C
1
Standard
2U
Standard Perform-
ance
6 4
Standard
1U
GPU
Perform-
ance
4 4
2 4
165–240
2
30°C
1
Perform-
ance (T-
shape)
Standard Perform-
ance
6 4
GPU
Perform-
ance
4 4
2 4
250–270 25°C
2
Perform-
ance (T-
shape)
Standard Perform-
ance
6 4
GPU
Perform-
ance
4 4
2 4
12 x 3.5"
105–150 25°C
2
Standard
2U
Standard Perform-
ance
6 4
Standard
1U
GPU
Perform-
ance
4 4
2 4
165–240
2
25°C
2
Perform-
ance (T-
shape)
Standard Perform-
ance
6 4
GPU
Perform-
ance
4 4
2 4
250–270 20°C
Perform-
ance (T-
shape)
Standard Perform-
ance
6 4
GPU
Perform-
ance
4 4
2 4
Notes:
• *The following processors have below exceptions:
– The Intel Xeon 6334 HCC 165W processor should follow rules for processors with TDP ranging from
220 watts to 240 watts.
Chapter 4. Hardware replacement procedures 195