Revision:1.0(2023-01-12)
418
• Upper-level test item
Communication Test Between PC Module and MF FPGA
• Test Items
Read the value of the TEE temperature signal. If the value can be sampled, the TEE
temperature signal collection is normal.
• Test failure analysis
If the test result is Error, the drive is abnormal.
If the test result is FAIL, the TEE temperature signal collection link is faulty.
• Troubleshooting suggestion
1. If the test result is Error, restart the device and re-perform the self-test. If the problem persists,
restore the device.
2. If the test result is FAIL, replace the main board.
Z0802 TEE Angle Signal Test
• Upper-level test item
Communication Test Between PC Module and MF FPGA
• Test Items
Read the value of the TEE temperature signal. If a value can be sampled, TEE temperature
signal collection is normal.
• Test failure analysis
If the test result is Error, the drive is abnormal.
If the test result is FAIL, the TEE angle signal collection link is faulty.
• Troubleshooting suggestion
1. If the test result is Error, restart the device and re-perform the self-test. If the problem persists,
restore the device.
2. If the test result is FAIL, replace the main board.
Z0901 Main Display I2C Communication Test
• Upper-level test item
Communication Test Between PC Module and MF FPGA
• Test Items
Test whether I2C bus communication between MF FPGA and the main display LCD works
well. Read data on the LCD through the I2C bus. Judge whether it is not 0 or not F, and then
parse the software and hardware versions of the main display LCD.
• Test failure analysis
If the test result is Error, the drive is abnormal.
If the test result is FAIL, the connection between MF FPGA and the main display is abnormal.
• Troubleshooting suggestion
1. If the test result is Error, restart the device and re-perform the self-test. If the problem persists,
restore the device.
Diagnostic Ultrasound System
Service Manual
9 Appendix
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