Remove the Motherboard Assembly
See “Take Antistatic Measures” on page 57.
d.
Remove the server top cover.
See “Remove the Server Top Cover” on page 58.
2.
Remove the Oracle Storage 12 Gb/s SAS PCIe RAID HBA card and its associated
super capacitor.
See “Remove the Sun Storage 12 Gb/s SAS PCIe RAID HBA Card” on page 124.
3.
Remove the air baffle.
Remove the air baffle by lifting the baffle up and out of the server.
4.
Remove the following reusable components:
Caution - During the motherboard removal procedure, it is important to label power supplies
with the slot numbers from which they were removed (PS0, PS1). This is required because the
power supplies must be reinstalled into the slots from which they were removed; otherwise, the
server key identity properties (KIP) data might be lost. When a server requires service, the KIP
is used by Oracle to verify that the warranty on the server has not expired. For more information
on KIP, see “FRU Key Identity Properties (KIP) Automated Update” on page 49.
■
Fan modules
See “Remove a Fan Module” on page 67.
■
SAS storage drive cables
See “Remove SAS Storage Drive Cables” on page 118.
■
PCIe cards
See “Remove a PCIe Card” on page 88.
■
Power supplies
See “Remove a Power Supply” on page 73.
5.
Disconnect the power cable from the motherboard to the rear storage drive
backplane [1].
See “Servicing the Storage Drive Backplanes” on page 112.
6.
Disconnect the ribbon cables from the left front I/O module and right front I/O
modules [1].
146 Oracle Exadata Storage Server X5-2 High Capacity Service Manual • January 2018
To Next Page
Loading...
