Mechanical Data and Ordering Information
MOTOROLA
MPC823e REFERENCE MANUAL
23-3
MECHANICAL DATA AND
23
ORDERING INFORMATION
23.3 PBGA PACKAGE DIMENSIONS
The following figure is a 23x23mm package, which has 1.27mm spacing between pads. The
device designator for the MPC823e in this package is ZT. For more information on the
printed circuit board layout of the plastic ball grid array (PBGA) package, including thermal
via design and suggested pad layout, please refer to AN-1231/D,
Plastic Ball Grid Array
Application Note
available from your local Motorola sales office.
CASE 1130-01
ISSUE A
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
256X
BOTTOM VIEW
E
0.20
765432
b
0.15 C
D
D2
E2
A
B
0.30 C
AB
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A 1.91 2.35
A1 0.50 0.70
A2 1.12 1.22
A3 0.29 0.43
b 0.60 0.90
D 23.00 BSC
D1 19.05 REF
D2
E 23.00 BSC
E1 19.05 REF
E2 19.00 20.00
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO
PRIMARY DATUM C.
4. PRIMARY DATUM C AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4X
8 9 10 11 12 13 14 15 16
M
M
TOP VIEW
(D1)
15X
e
15X
e
(E1)
4X
e
/2
0.20 C
0.35 C
A3
256X
C
A
A1
A2
SEATING
PLANE
e 1.27 BSC
19.00 20.00
1
To Next Page
Loading...
