222 Upgrade and Maintenance Manual BX924 S4
Processors
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9.6 Applying thermal paste
I – For the Japanese market, the service engineer must follow the
instruction provided separately.
– If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied
to its lower surface. In this case, please proceed with section
"Installing processor heat sinks" on page 211.
Figure 98: Thermal paste syringe
One thermal compound syringe (FSP:P304000003) contains thermal paste for
two processors.
Field Replaceable Units (FRU)
Average task duration: 5 minutes
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