Applying the thermal paste to the heat sink surface
For Japan, the service engineer must follow the instruction provided
separately.
If the CPU upgrade or replacement kit contains a new heat sink, a thin
layer of thermal compound has already been pre-applied to its lower
surface. In this case, it isn’t necessary to apply thermal paste to the heat
sink lower surface.
Figure 161: Thermal paste syringe
One thermal compound syringe (FSP:P304000004) contains thermal paste for
three CPUs.
In order to determine the correct amount of thermal paste (equal to 1.0 gram),
divide the grey area of the syringe up into three equal segments.
Add graduation marks to the syringe using a permanent marker to help
you apply the thermal paste.
Processor (CPU)
274 Upgrade and Maintenance Manual RX4770 M6
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