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LDI Intellectual Property.
Not for secondary distribution or replication, in part or entirety.
DIGISONDE-4D
SYSTEM MANUAL
VERSION 1.2.11
SECTION 4 HARDWARE DESCRIPTION 4-7
4:2. The major sub-assemblies of Digisonde-4D include:
a. Oven controlled 61.44 MHz frequency source (the Master Oscillator).
b. Card cage with analog and digital cards for signal generation and reception.
i. Digital Transmitter/Timing card
ii. Four Tracking Bandpass Filter cards (trackers)
iii. Digital Receiver card
iv. Pre-Processor card
v. Built In Test (BIT) card
vi. Backplane
c. Data Platform Computer embedded PCE-4129 single board computer with passive backplane.
Computer sub-system components are:
a. Intel Xeon E3
b. 32 DB DDR4 RAM
c. Intel C236 Chipset
d. 4 x SATA 3.0 ports
e. 7 x USB 2.0 and 3x USB 3.0 ports
f. LAN 1: Intel I219LM
g. LAN 2: Intel 1210AT
h. 2 x RS-232 ports
i. 4 x RS-422/485 via LPC connector and daughter card
d. Control Platform Computer- embedded HS- single board computers with passive PISA back-
planes. Computer sub-system components are:
i. Intel Pentium Core2 Duo processor
ii. (Up to) 2 GB DDR2 667 MHz RAM
iii. Intel 945GM Graphic Controller
iv. 2 x Intel 82573L Gigabit Ethernet Controllers
v. 2 x Serial ATA Interfaces
vi. 1 x ATA Controller
vii. 1 RS232 port
viii. 1 RS232/RS422 port
ix. 4 USB 2.0 ports
x. 1 Mini PCI Socket
xi. Compact Flash Type II Socket

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