LSIS XEC-DP64H - Performance Specifications; Performance Specifications of XGB Built-In Positioning

Chapter 1 General
1- 3
1.2.1
Performance specifications of XGB built-in positioning
The performance specifications of positioning function are as follows.
Here standard type indicates XBM-DN□□S/ XBC-DN
□□ S(U) and high end type indicate XBC(XEC)-DN□□H.
Each type is indicated as ‘S’ type and ‘H’ type.
Type
Item
XGB Basic Unit (Transistor output )
Standard type (“S” type) High-end type (“H” type)
No. of control axis
2 axes
Interpolation
2 axes linear interpolation
Pulse output method
Open collector (DC 24V)
Pulse output type Pulse + Direction
Pulse + Direction
CW/CCW output
Control type
Position control, speed control, speed/position switching, position/speed
switching
Control unit Pulse
Position data
30 data areas per axis
(operation step no. 1 ∼ 30)
* XBC-DN□□S(U) supports 80
data areas per axis
80 data areas per axis
(operation step no. 1 ~ 80)
Setting
method
Setting through Embedded parameter of XG5000 
permanent
auto-preservation
Setting through dedicated monitoring package  perman
ent
preservation by PADT instruction
Setting through K area dedicated for positioning
 permanent preservation by application instruction
(WRT/APM_WRT instruction)
Positioning monitor Special module monitoring of XG5000 / monitoring by K area
Back-up
Parameter, operation data  Flash memory
K area RAM (super capacitor back up for S type/ battery back up for H type)
(Saving them in the flash memory is available by application
instruction(WRT/APM_WRT))
Position
Position method
Absolute method / Incremental method
Position address
range
-2,147,483,648 ∼ 2,147,483,647(Pulse)
Speed range
1 ∼ 100,000pps(1pps unit)
Acc/dec processing Trapezoid-shaped
Acc/dec time
1 ∼ 10,000 ㎳ (selectable from 4 types of acc/dec patterns)
Max. output pulse 100 kpps
Max. connection distance
2 m
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1.2 Performance specifications