363-206-305
Applications
2-32
Issue 3 June 2000
Figure 2-22. LAN/WAN Data Networking
High Data-rate Subscriber Line (HDSL)
Application
2
The HDSL circuit pack (BBF8) provides HDSL interface capability on the DDM-
2000 OC-3 shelf to compatible
PairGain
*
equipment at the customer premises. It
allows the transport of DS1 rate payloads, for up to 12,000 feet, over two metallic
24 AWG twisted-pair lines. Figure 2-23 shows examples of HDSL circuit packs
providing this capability in both the DDM-2000 OC-3 and the DDM-2000
* PairGain is a registered trademark of PairGain Technologies, Inc.
22F or G type OLIU
tpa 852455/01
OC-3 Path Switched Ring
28G type OLIU
DDM-2000
FiberReach
BBG19
DDM-2000
OC-3
BBG19
0x1
DS1
Data Service
Terminal
DS1s
0x1
DS3
Data
Service
DS3
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