6881096C73-O June 11, 2003
Disassembly/Reassembly Procedures: Chassis Thermal Pad Replacement Procedure 8-31
To repair the black thermal pad (Item 3):
1. Use a plastic flat-edge tool (like a black-stick solder aid) to lift the pad from the chassis
surface. The pad is an elastomer-coated sheet of foil. The foil sheet will lift off in pieces. The
black elastomer residue will remain on the chassis.
2. Scrape the residue off using a plastic flat-edge tool, such as a dismantling tool (Motorola P/N
6686119B01).
3. After scraping off as much residue as possible, use a soft cloth with alcohol to remove the
remaining residue. Care should be taken to minimize any cleaning-agent contact with the
surrounding shield gasket.
4. Once the surface is clean and dry, use tweezers to remove a new pad from the shipping liner.
5. Position the pad on the chassis using any two screw holes as a visual cue.
6. Carefully place the pad down to avoid wrinkling the pad or trapping air bubbles under the pad.
7. Apply even pressure to activate the pressure-sensitive adhesive.
To repair the cover pad (7585860F01) shown in the exploded view, Figure 11.5 “XTL 5000 (3.5-
35 W) Radio Exploded View” on page 11-6:
1. Use a plastic flat-edge tool (like a black-stick solder aid) to lift the pad from the top cover
boss.
2. Discard the old pad, and use a soft cloth to remove any remaining residue. Alcohol can also
be used, if necessary. Care should be taken to minimize any cleaning-agent contact with the
surrounding shield gasket.
3. Once the surface is clean and dry, use tweezers to remove the blue liner from the pad.
4. Place the pad pink-side-down on the cover boss.
5. Use your finger to apply pressure to the pad. The yellow side is visible when the pad is
installed correctly.
Use of a metal tool will scratch the heat sink surface and reduce
the thermal effectiveness.
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C a u t i o n
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