Lenovo ThinkSystem SR630 V3 - Page 77

Configuration • 4 x 2.5'' SAS/SATA
• 4 x 2.5'' NVMe
• 4 x 3.5'' SAS/SATA
• 4 x 3.5'' AnyBay
• 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe
• 6 x SAS/SATA + 4 x AnyBay
• 8 x 2.5'' SAS/SATA
• 8 x 2.5'' AnyBay drives with one processor
• 8 x 2.5'' U.2 drives with one processor
• 10 x 2.5'' SAS/SATA
• 10 x 2.5'' AnyBay
• 10 x 2.5'' NVMe
• 4 x 2.5'' SAS/
SATA
• 4 x 2.5''
NVMe
Max. Ambient
Temp. (at sea level)
30°C
CPU TDP
1
(watts)
TDP ≤ 165 165 < TDP < 205 TDP = 205 205 < TDP ≤ 250 250 < TDP ≤ 300
Heat sink
Standard Standard
T-shape T-shape T-shape
Air baffle
√ √
x x x
Fan type Performance Performance Performance Performance Performance
Max GPU Qty
3 3 3 3 3
Max. DIMM Qty.
32 32 32 32 32
Notes:
1. TDP, short for Thermal Design Power. When processor 6434/6434H-195W installed, use the T-shape
heat sink and performance fans.
Server models with liquid assisted cooling module
This section provides thermal information for server models installed with the Liquid Assisted Cooling
Module (LACM).
Configuration • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe
• 6 x SAS/SATA + 4 x AnyBay
• 8 x 2.5'' SAS/SATA
• 8 x 2.5'' U.2 drives with one processor
• 10 x 2.5'' SAS/SATA
• 10 x 2.5'' NVMe
Max. Ambient
Temp. (at sea level)
25°C
CPU TDP (watts)
300 ≤ TDP ≤ 350
Heat sink Liquid assisted cooling module
Air baffle
x
Fan type Performance
Max. DIMM Qty.
1
32
Notes:
1. The 256 GB 3DS RDIMMs are not supported.
Use performance fans when your server is installed with any of the following adapters:
• ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter
Chapter 5. Hardware replacement procedures 67