SMAR LC700 - default chapter; Table of Contents

Table of Contents
VII
TABLE OF CONTENTS
CHAPTER 1 - OVERVIEW OF A LC700 SYSTEM......................................................................................1.1
CHAPTER 2 - LC700 ARCHITECTURE......................................................................................................2.1
RACKS AND MODULES ........................................................................................................................................2.1
BASIC COMPONENTS ....................................................................................................................................................2.1
RACKS, CABLES AND ACCESSORIES OF LC700 SYSTEM ..............................................................................2.2
INSTALLING THE SYSTEM’S BASE WITH DF93 RACKS....................................................................................2.2
INSTALLING RACKS - DF93............................................................................................................................................2.3
INSTALLING THE EXPANSION FLAT CABLES - DF101, DF102, DF103, DF104 AND DF105......................................2.5
FLAT CABLES PROTECTOR (CONNECTOR CAP)........................................................................................................2.6
INSTALLING THE IMB TERMINATOR – T-700 OR DF96 ...............................................................................................2.6
EXPANDING THE SYSTEM’S POWER - DF90 AND DF91.............................................................................................2.8
DIAGNOSTIC RESOURCES..........................................................................................................................................2.12
INSTALLING THE SYSTEM’S BASE WITH R-700-4A RACK..............................................................................2.13
INSTALLING A RACK IN THE DIN RAIL........................................................................................................................2.14
ADDING RACKS.............................................................................................................................................................2.14
TIPS FOR ASSEMBLING...............................................................................................................................................2.14
IMPROVING SIGNAL GROUND OF LC700 (R-700-4A) ................................................................................................2.15
INSTALLING A MODULE .....................................................................................................................................2.16
DIMENSIONAL DRAWINGS OF R700-4 AND MODULES ..................................................................................2.20
DIMENSIONAL DRAWINGS OF DF93 AND MODULES .....................................................................................2.21
REQUERIMENTS FOR LC700 INSTALLATION AND TRANSPORTATION........................................................2.22
INITIAL INSPECTION.....................................................................................................................................................2.22
LOCAL CONDITIONS FOR INSTALLATION..................................................................................................................2.22
TRANSPORTATION CONDITIONS ...............................................................................................................................2.23
CPU COMMUNICATION ......................................................................................................................................2.23
MODBUS AND HMI INTERFACE.........................................................................................................................2.24
HOT SWAP ...........................................................................................................................................................2.24
MODULE ID ..........................................................................................................................................................2.24
FIELDBUS SUPPORT ..........................................................................................................................................2.24
CHAPTER 3 - MODULES AND ACCESSORIES ........................................................................................3.1
INTRODUCTION.....................................................................................................................................................3.1
MODULES LIST......................................................................................................................................................3.1
MODULE SPECIFICATION FORMAT....................................................................................................................3.4
CPU-700-C3 - PROCESSOR MODULE.................................................................................................................3.5
TECHNICAL SPECIFICATIONS.......................................................................................................................................3.5
COMMUNICATION CHANNELS ......................................................................................................................................3.7
DEVICE COMMUNICATION BAUD RATE AND DEVICE ADDRESS..............................................................................3.8
CPU-700-D3 - PROCESSOR MODULE.................................................................................................................3.9
TECHNICAL SPECIFICATIONS.....................................................................................................................................3.10
COMMUNICATION CHANNELS ....................................................................................................................................3.11
DEVICE COMMUNICATION BAUD RATE AND DEVICE ADDRESS............................................................................3.13
CPU-700 OPERATION MODES.....................................................................................................................................3.13
CPU-700-D3R - REDUNDANT CPU MODULE ....................................................................................................3.15
TERMINOLOGY AND INITIAL DESCRIPTIONS............................................................................................................3.15
ARCHITECTURE............................................................................................................................................................3.17
POWER –UP PROCEDURE...........................................................................................................................................3.18
COMMUNICATION WITH THE REMOTE I/O MODULES..............................................................................................3.20
TECHNICAL SPECIFICATIONS.....................................................................................................................................3.21
RIO-700-D3 - REMOTE I/O COMMUNICATION INTERFACE.............................................................................3.23
DESCRIPTION ...............................................................................................................................................................3.23
ADDING A REMOTE I/O UNIT.......................................................................................................................................3.23
REMOTE I/O ARCHITECTURE......................................................................................................................................3.24
BAUD RATE AND RIO ADDRESS SETTINGS ..............................................................................................................3.24
RIO LIMITS.....................................................................................................................................................................3.24
CPU-700-E3 - PROCESSOR MODULE ...............................................................................................................3.25
DESCRIPTION ...............................................................................................................................................................3.25
TECHNICAL SPECIFICATIONS.....................................................................................................................................3.25