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Lenovo ThinkSystem SR630 V4 - Page 231

Lenovo ThinkSystem SR630 V4
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Figure 221. PHM components
1 Heat sink 9 Processor carrier
2 Processor identification label
10 Clips to secure processor in a carrier
3 Heat sink triangular mark
11 Carrier triangular mark
4 Nut and wire bail retainer 12 Processor ejector handle
5 Torx T30 nut 13 Thermal grease
6 Anti-tilt wire bail 14 Processor heat spreader
7 Clips to secure carrier to a heat sink
15 Processor triangular mark
8 Processor carrier code marking 16 Processor contacts
Torque screwdriver type list Screw Type
Torx T30 head screwdriver Torx T30 screw
Procedure
Step 1. Make preparations for this task.
a. Remove the top cover. See
“Remove the top cover” on page 282.
b. Remove the air baffle. See
“Remove the air baffle” on page 97.
Step 2. If the processor comes with a T-shaped heat sink, fully loosen the two heat sink screws as shown.
Chapter 5. Hardware replacement procedures 221

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