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Lenovo ThinkSystem SR630 V4 - Separate the Processor from Carrier and Heat Sink

Lenovo ThinkSystem SR630 V4
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After you finish
Each processor socket must always contain a cover or a PHM. Protect empty processor sockets with a
cover or install a new PHM.
If you are not going to install a PHM back, cover the processor socket with the socket cover and install a
PHM filler.
Open the retaining clip on each end of the memory module slots next to the left and right sides of
the processor two slot.
Align the PHM filler with the slots, and place the filler on the slots with both hands. Firmly press the
filler straight down into the slots until the retaining clips snap into the locked position.
If you are removing the PHM as part of a processor board replacement, set the PHM aside.
If you are reusing the processor or heat sink, separate the processor from its retainer. See
“Separate the
processor from carrier and heat sink” on page 223
.
If you are instructed to return the component or optional device, follow all packaging instructions, and use
any packaging materials for shipping that are supplied to you.
Separate the processor from carrier and heat sink
This task has instructions for separating a processor and its carrier from an assembled processor and heat
sink, known as a processor-heat-sink module (PHM). This procedure must be executed by a trained
technician.
About this task
Attention:
Read
“Installation Guidelines” on page 57 and “Safety inspection checklist” on page 58 to ensure that you
work safely.
Power off the server and peripheral devices and disconnect the power cords and all external cables. See
“Power off the server” on page 75.
Keep static-sensitive parts in their static-protective packages until installation to prevent exposure to
static electricity. Handle the parts with an electrostatic-discharge wrist strap or other grounding systems.
Place the parts on a static-protective surface.
Chapter 5. Hardware replacement procedures 223

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