Lenze I/O system 1000 - Device architecture

Lenze · I/O system 1000 · Reference Manual · DMS 5.0 EN · 09/2016 · TD17 16
2 Product description
2.1 Device architecture
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2.1 Device architecture
Device architecture of the I/O system 1000
 Bus coupler module
• CANopen: EPM-S110
•PROFIBUS: EPM-S120
• EtherCAT: EPM-S130
•PROFINET: EPM-S140
• DeviceNet: EPM-S150
• Modbus TCP: EPM-S160
 I/O compound modules, max. 64
 Connection to the bus system (CANopen/EtherCAT)
• CANopen, PROFIBUS: via a 9-pole Sub-D plug (see illustration)
• EtherCAT: RJ45, double
 Internal backplane bus for communication between the bus coupler module and the I/O compound modules
• Side-by-side mounting of the module feet of the I/O compound modules provides for the electrical
connection to the bus coupler module.
 Supply voltage DC 24 V, max. 10 A for consumers at output modules
• Side-by-side mounting of the module feet of the I/O compound modules provides for the electrical
connection to the bus coupler module.
 Supply voltage DC 24 V for the electronics
• Side-by-side mounting of the module feet of the I/O compound modules provides for the electrical
connection to the bus coupler module.
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