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Pitney Bowes Epic v3.1 - Page 305

Pitney Bowes Epic v3.1
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l Short folds that result in either the lead or trail edge being 1.5 times as thick as or thicker than the
opposite edge are not allowed (see diagram).
Short Folds - Thickness
Ink and Surface Condition
l Ink should be dry or set sufficiently to prevent enclosures from sticking together (blocking).
l Ink should not smudge when enclosures are rubbed together.
l Powder should not be used to prevent enclosures from sticking together (blocking).
Envelopes (BRE)
l All types of envelopes are allowed. Overall thickness may not be more than 50% greater in the
center than at the leading edge (i.e. if leading edge is two papers thick, center cannot be more than
three papers thick).
l Die cut envelope must be fed with window down, flap leading.
Die Cuts
l Die cut holes with and without windows are allowed as long as there is an area under the hole that
is not die cut.
l Die cut pressure sensitive labels with a backing sheet are allowed.
l Die cut labels without a backing sheet (such as remoistenable adhesive “stickers”) are not allowed.
Glue
l Any enclosure with glued features must not allow stray glue to attach enclosures together.
l Exposed “remoistenable” adhesive is not allowed.
Attached Cards
l Cards must be attached with at least two glue lines to a carrier sheet.
l Cards should be centered on the carrier sheet in both side-to-side and lengthwise orientations.
l Carrier sheet must not exceed two times the length of the card. Requires application review.
Specifications
Pitney Bowes Epic v3.1 (ZVE0) Operator Guide May, 2018 Page 298 of 328

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