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STMicroelectronics STM32F407 User Manual

STMicroelectronics STM32F407
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DocID018909 Rev 11 59/1731
RM0090 Memory and bus architecture
112
2 Memory and bus architecture
2.1 System architecture
In STM32F405xx/07xx and STM32F415xx/17xx, the main system consists of 32-bit
multilayer AHB bus matrix that interconnects:
The main system consists of 32-bit multilayer AHB bus matrix that interconnects:
Eight masters:
–Cortex
®
-M4 with FPU core I-bus, D-bus and S-bus
DMA1 memory bus
DMA2 memory bus
DMA2 peripheral bus
Ethernet DMA bus
USB OTG HS DMA bus
Seven slaves:
Internal Flash memory ICode bus
Internal Flash memory DCode bus
Main internal SRAM1 (112 KB)
Auxiliary internal SRAM2 (16 KB)
AHB1 peripherals including AHB to APB bridges and APB peripherals
AHB2 peripherals
–FSMC
The bus matrix provides access from a master to a slave, enabling concurrent access and
efficient operation even when several high-speed peripherals work simultaneously. The 64-
Kbyte CCM (core coupled memory) data RAM is not part of the bus matrix and can be
accessed only through the CPU. This architecture is shown in Figure 1.

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STMicroelectronics STM32F407 Specifications

General IconGeneral
SeriesSTM32F4
CoreARM Cortex-M4
Max Clock Speed168 MHz
Flash MemoryUp to 1 MB
SRAMUp to 192 KB
ADC Resolution12-bit
DAC Channels2
DAC Resolution12-bit
I2CUp to 3
SPI3
Timers17
USBUSB
Communication InterfacesUSB, I2C, SPI
Operating Supply Voltage1.8 V to 3.6 V
Operating Temperature-40°C to +85°C
PackageLQFP100, LQFP64

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