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HP xw4600 User Manual

HP xw4600
176 pages
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Asset tracking and security ................................................................................................ 40
Password security ............................................................................................ 41
Establishing a setup password using the Computer Setup (F10)
Utility ................................................................................................. 41
Establishing a power-on password using workstation setup ............ 42
Entering a power-on password ........................................................ 42
Entering a Setup Password .............................................................. 43
Changing a power-on or setup password ......................................... 43
Deleting a power-on or setup password ............................................................ 44
National keyboard delimiter characters ............................................ 44
Clearing passwords .......................................................................... 45
DriveLock .......................................................................................... 45
Hood Sensor (Smart Cover Sensor) (optional) ................................................. 47
Setting the Hood Sensor protection level ........................................ 47
Hood Lock (Smart Cover Lock) (optional) ......................................................... 47
Locking the Hood Lock ..................................................................... 48
Unlocking the Hood Lock .................................................................. 48
Using the FailSafe key ...................................................................... 48
Cable lock (optional) ......................................................................................... 48
Security lock (Padlock loop) (optional) .............................................................. 49
Universal chassis clamp lock (optional) ............................................................ 49
Fault notification and recovery ........................................................................................... 49
Drive Protection System .................................................................................... 49
ECC fault prediction .......................................................................................... 49
Thermal sensors ............................................................................................... 49
Dual-state power button ..................................................................................................... 49
4 Removal and replacement procedures
Warnings and cautions ....................................................................................................................... 52
Service considerations ....................................................................................................................... 53
Cautions, warnings, and safety precautions ...................................................................... 53
ESD information ................................................................................................................. 53
Generating static ............................................................................................... 53
Preventing ESD equipment damage ................................................................. 54
Personal grounding methods and equipment ................................................... 54
Grounding the work area ................................................................................... 55
Recommended ESD prevention materials and equipment ............................... 55
Tools and software requirements ...................................................................................... 56
Screws ............................................................................................................................... 56
Special handling of components ........................................................................................ 57
Cables and connectors ..................................................................................... 57
Hard drives ........................................................................................................ 57
Lithium coin cell battery ..................................................................................... 58
Customer Self-Repair ......................................................................................................................... 58
Predisassembly procedures ............................................................................................................... 58
System board components ................................................................................................................. 59
Removing and replacing components ................................................................................................ 60
Disassembly order ............................................................................................................. 61
Security lock (Padlock loop) (optional) .............................................................................. 62
Removing the security lock ............................................................................... 62
ENWW v

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HP xw4600 Specifications

General IconGeneral
Tcase72.4 °C
Bus typeFSB
SteppingE0
Processor cache6 MB
Processor cores2
Processor modelE8400
System bus rate- GT/s
Processor familyIntel® Core™2 Duo
Processor seriesIntel Core 2 Duo E8000 Series
Processor socketLGA 775 (Socket T)
Processor codenameWolfdale
Processing Die size107 mm²
Processor frequency3 GHz
Processor cache typeL2
Processor lithography45 nm
Processor manufacturerIntel
Processor front side bus1333 MHz
Processor operating modes64-bit
ECC supported by processorNo
Thermal Design Power (TDP)65 W
Number of processors installed1
CPU multiplier (bus/core ratio)9
Number of Processing Die Transistors410 M
Audio systemHigh Definition Audio
Product typeWorkstation
Motherboard chipsetIntel® X38 Express
ECCYes
Internal memory2 GB
Memory clock speed800 MHz
Internal memory typeDDR2-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)2 x 1 GB
HDD speed7200 RPM
HDD capacity250 GB
HDD interfaceSATA
Optical drive typeDVD-RW
Graphics card-
Networking featuresGigabit Ethernet (10/100/1000)
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply475 W
Chassis typeTower
Country of originChina
Processor codeSLB9J
Processor ARK ID33910
Processor package size37.5 x 37.5 mm
On-board graphics card modelNot available
Weight and Dimensions IconWeight and Dimensions
Depth456 mm
Width168 mm
Height450 mm
Weight19000 g

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