HP xw4600 User Manual

Installing the front panel I/O device assembly
To instal the front panel I/O device assembly:
1. Thread each front panel I/O device assembly cable through the same holes from which they were
removed.
2. Push the front panel I/O device assembly into the chassis. Using your fingers, orient the cables so
that there is enough room for the front panel I/O device assembly to easily fit in its slot.
3. Loosely place the bracket on the front panel I/O device assembly and hook the bracket to the
chassis.
4. Screw the bracket to the front panel I/O device assembly, and then screw the bracket to the chassis.
5. Connect the front audio cable to the audio connector (1). Connect the front USB cable to the USB
connector (2). Connect the front control panel cable to the control panel connector (3). If an
IEEE-1394 card is installed, connect the front IEEE-1394 cable to the card connector.
Figure 4-15 Attaching the front panel I/O device assembly cables
Power button assembly
This section describes how to remove the power button assembly.
Removing the power button assembly
To remove the power button assembly:
1. Disconnect power from the system (
Predisassembly procedures on page 58), remove the side
access panel (
Removing the side access panel on page 64), remove the front bezel (Removing
the front bezel on page 68), and then remove the front panel I/O device assembly (Removing the
front panel I/O device assembly on page 69).
ENWW Removing and replacing components 71

HP xw4600 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Audio system	High Definition Audio
Product type	Workstation
Motherboard chipset	Intel® X38 Express
ECC	Yes
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD-RW
Graphics card	-
Networking features	Gigabit Ethernet (10/100/1000)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply	475 W
Chassis type	Tower
Country of origin	China
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm
On-board graphics card model	Not available

Weight and Dimensions

Depth	456 mm
Width	168 mm
Height	450 mm
Weight	19000 g