HP xw4600 User Manual

2. Gently push the subpanel out the back of the front bezel (1).
Figure 4-12 Removing the bezel blanks
3. Remove the desired bezel blank by applying outward pressure on the subpanel (1) and pulling the
blank away (2).
NOTE: The bezel blanks are keyed to assist you in replacing them. Also, the subpanel can be rotated
90 degrees to install optical drives in a desktop orientation.
Front panel I/O device assembly
This section describes how to remove and install a front panel I/O device assembly.
Removing the front panel I/O device assembly
To remove the front panel I/O device assembly:
1. Disconnect power from the system (
Predisassembly procedures on page 58), remove the side
access panel (
Removing the side access panel on page 64), and then remove the front bezel
(
Removing the front bezel on page 68).
ENWW Removing and replacing components 69

HP xw4600 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Audio system	High Definition Audio
Product type	Workstation
Motherboard chipset	Intel® X38 Express
ECC	Yes
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD-RW
Graphics card	-
Networking features	Gigabit Ethernet (10/100/1000)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply	475 W
Chassis type	Tower
Country of origin	China
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm
On-board graphics card model	Not available

Weight and Dimensions

Depth	456 mm
Width	168 mm
Height	450 mm
Weight	19000 g