HP xw4600 User Manual

Disassembly order
Use the following table to determine the sequence in which to remove major workstation components.
Table 4-5 Workstation component disassembly order
Predisassembly (Predisassembly procedures
on page 58)
Security lock (Security lock (Padlock loop)
(optional) on page 62
Side access panel (Side access panel
on page 64)
Hood Sensor (Hood Sensor (Smart Cover Sensor)
(optional) on page 65)
Smart Cover Lock solenoid (Smart Cover Lock solenoid
(optional) on page 66)
Front bezel (Front bezel
on page 67)
Bezel blanks (Bezel blanks on page 68)
Front panel I/O device assembly (Front panel I/O device
assembly on page 69)
Power button assembly (Power button
assembly on page 71)
Optical drives (Optical drive (minitower configuration)
on page 90, Optical drive (desktop configuration)
on page 92
Diskette drive (Diskette drive (optional)
on page 95)
System speaker (System speaker
on page 72)
Power supply (Power supply
on page 73)
System fan (System fan assembly
on page 74)
PCI card guide and front fan (optional) (Front PCI card
guide and fan removal (optional) on page 86)
Memory (Memory on page 75)
PCI retainer (PCI card
support bracket
on page 80)
PCI slots (PCI card slots
on page 79)
PCI Express card (PCI Express cards
on page 81)
PCI card (PCI card
on page 83)
ENWW Removing and replacing components 61

HP xw4600 Specifications

General

Tcase	72.4 °C
Bus type	FSB
Stepping	E0
Processor cache	6 MB
Processor cores	2
Processor model	E8400
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo E8000 Series
Processor socket	LGA 775 (Socket T)
Processor codename	Wolfdale
Processing Die size	107 mm²
Processor frequency	3 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	65 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	9
Number of Processing Die Transistors	410 M
Audio system	High Definition Audio
Product type	Workstation
Motherboard chipset	Intel® X38 Express
ECC	Yes
Internal memory	2 GB
Memory clock speed	800 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	2 x 1 GB
HDD speed	7200 RPM
HDD capacity	250 GB
HDD interface	SATA
Optical drive type	DVD-RW
Graphics card	-
Networking features	Gigabit Ethernet (10/100/1000)
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Power supply	475 W
Chassis type	Tower
Country of origin	China
Processor code	SLB9J
Processor ARK ID	33910
Processor package size	37.5 x 37.5 mm
On-board graphics card model	Not available

Weight and Dimensions

Depth	456 mm
Width	168 mm
Height	450 mm
Weight	19000 g