Hardware options installation 126
10.
Install the node into the chassis ("Installing a node into the chassis" on page 60).
11. Connect all peripheral cables to the nodes.
12. Power up the node ("Power up the nodes" on page 32).
Processor and heatsink
For more information about product features, specifications, options, configurations, and compatibility,
see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).
To install the component:
1. Power down the node (on page 32).
2. Disconnect all peripheral cables from the node.
3. Remove the node from the chassis (on page 32).
4. Place the node on a flat, level surface.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To avoid damage to the processor and s
ystem board, only authorized personnel
should attempt to replace or install the processor in this node.
CAUTION: To prevent possible node malfunction and damage to the equipment,
multiprocessor configurations must contain processors with the same part number.
CAUTION:
The heatsink thermal interface media is not reusable and must be replaced if the
heatsink is removed from the processor after it has been installed.
IMPORTANT: Processor socket 1 must be populated at all times or the node does not
function.
5. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly ("FlexibleLOM 2U
node riser cage assembly" on page 52).
6. If installed in a 2U node, remove the three-slot riser cage assembly ("Three-slot riser cage
assemblies" on page 52).
7. Remove the air baffle (on page 41).
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