iv Application Note 653: Thermal Design Considerations
Figures
1 Example of air exchange through a PC chassis..............................................6
2 Fan Placement and Layout of an ATX Form Factor Chassis - Top View ........8
3 Fan Placement and Layout of an NLX Form Factor Chassis - Top View ........8
4 Low Profile Fan Heat Sink Drawing...............................................................11
5 PCB Layout Guidelines for Mounting Holes ..................................................12
6 Fan Heat Sink Connector Design ..................................................................13
7 Tape Layers...................................................................................................15
8 Attaching the Tape to the Package and Heat Sink........................................15
9 Completing the Attach Process .....................................................................16
10 Technique for Measuring Tcase with 0° Angle Attachment ..........................20
11 Technique for Measuring Tcase with 90° Angle Attachment ........................20
12 Thermal Enhancement Decision Flowchart...................................................21
Tables
1 Intel740 Graphics Accelerator Preliminary Thermal Absolute Maximum Rating
3
2 Default Thermal Solution Reliability Validation..............................................13
3 Tape Attach Application Temperature/Pressure Option ................................17
4 Reliability Validation.......................................................................................17
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