Intel740™ Graphics Accelerator Thermal Design Considerations
22 Application Note 653
6.0 Conclusion
As the complexity of today’s graphics accelerators continues to increase, so do the power
dissipation requirements. Care must be taken to ensure that the additional power is properly
dissipated. Heat can be dissipated using improved system cooling, selective use of ducting and/or
passive heat sinks.
The simplest and most cost effective method is to improve the inherent system cooling
characteristics through careful design and placement of fans and ducts. When additional cooling is
required, thermal enhancements in conjunction with enhanced system cooling. The size of the fan
or heat sink can be varied to balance size and space constraints with acoustic noise. This document
has presented the conditions and requirements for properly designing a cooling solution a system
implementing the Intel740 graphics accelerator. Properly designed solutions provide adequate
cooling to maintain the Intel740 graphics accelerator case temperature at or below those listed in
Table 1. This is accomplished by providing a low local ambient temperature and creating a
minimal thermal resistance to that local ambient temperature. By maintaining the Intel740 graphics
accelerator case temperature at or below those recommended in this document, a system will
function properly and reliably.
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