Intel 740 User Manual

Application Note 653: Thermal Design Considerations iii
Contents
1.0 Introduction ...................................................................................................................1
1.1 Document Goals ..............................................................................................1
1.2 Importance of Thermal Management...............................................................1
1.3 Intel740™ Graphics Accelerator Packaging Terminology ...............................2
2.0 Thermal Specifications..................................................................................................3
2.1 Case Temperature...........................................................................................3
2.2 Power...............................................................................................................4
3.0 Designing for Thermal Performance.............................................................................5
3.1 Airflow Management ........................................................................................5
4.0 Cooling Solutions..........................................................................................................7
4.1 System Fans....................................................................................................7
4.1.1 Fan Placement....................................................................................7
4.1.2 Fan Direction.......................................................................................9
4.1.3 Size and Quantity................................................................................9
4.1.4 Fan Venting.........................................................................................9
4.1.5 Vent Placement...................................................................................9
4.1.5.1 Vent Area/Size.......................................................................9
4.1.5.2 Vent Shape ..........................................................................10
4.1.6 Ducting..............................................................................................10
4.1.6.1 Ducting Placement...............................................................10
4.2 Thermal Enhancements.................................................................................10
4.2.1 Clearance..........................................................................................10
4.2.2 Low Profile Fan Heat Sink ................................................................11
4.2.2.1 Low Profile Fan Heat Sink PCB Layout Guidelines .............11
4.2.2.2 Low Profile Fan Heat Sink Electrical Requirements ............12
4.2.2.3 Low Profile Fan Heat Sink Attach ........................................13
4.2.2.4 Low Profile Fan Heat Sink Reliability...................................13
4.2.3 Low Profile Passive Heat Sink..........................................................14
4.2.3.1 Clip Attach............................................................................14
4.2.3.2 Epoxy ...................................................................................14
4.2.3.3 Tape Attach..........................................................................15
4.2.3.4 Reliability..............................................................................17
4.3 Thermal Interface Management for Heat Sink Solutions ...............................17
4.3.1 Bond Line Management....................................................................18
4.3.2 Interface Material Performance.........................................................18
5.0 Measurements for Thermal Specifications..................................................................19
5.1 Case Temperature Measurements ................................................................19
5.2 Power Simulation Software............................................................................20
6.0 Conclusion ..................................................................................................................22
A Sources.......................................................................................................................23
A.1 Low Profile Fan Heat Sink Sales Locations...................................................23
A.2 Low Profile Passive Heat Sink Sales Locations.............................................23
A.3 Attach Sales Locations ..................................................................................23

Intel 740 Specifications

General

Brand	Intel
Model	740
Category	Video Card
Language	English