Intel740™ Graphics Accelerator Thermal Design Considerations
2 Application Note 653
1.3 Intel740™ Graphics Accelerator Packaging Terminology
BGA Ball Grid Array. A package type defined by a resin-fiber substrate on which a
die is mounted, bonded and encapsulated in molding compound. The primary
electrical interface is an array of solder balls attached to the substrate opposite
the die and molding compound.
Lands Pads on the PCB where BGA Balls are soldered.
Mold-Cap The black encapsulating molding compound. The top of this is where
maximum case temperatures are taken and where heat sinks are attached.
PCB Printed Circuit Board.
STBGA Super Thermal BGA. A Ball Grid Array Package enhanced to improve its
thermal characteristics. The Intel740 graphics accelerator uses this type of
BGA packaging.
Thermal Balls Typically, this refers to an array of balls in the center of the larger array of balls
which serve to channel heat into the PCB as well as ground connections.
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