Application Note 653 15
Intel740™ Graphics Accelerator Thermal Design Considerations
5. Join and secure the assembly centering the heat sink on the component. Wait for the adhesive
to fixture (approximately 5 minutes) before any further handling. Full cure occurs in 4-24
hours.
Note: The successful application of this product depends on accurate dispensing on to the parts being
bonded. The manufacturer (Section A, “Sources” on page 23) offers equipment engineers to assist
customers in selecting and implementing the appropriate dispensing equipment for various
applications.
To remove the heat sink after the epoxy has set, the manufacturer recommends applying heat
(70°C - 93°C) to the assembly. When in this temperature range the heat sink can safely be removed
from the component without damaging it.
4.2.3.3 Tape Attach
For users who prefer to attach via Tape, please refer to Section A, “Sources” on page 23 for the
suggested manufacturer and part number. To maximize the bond line contact area and improve
adhesion we recommend using two pieces of tape, one attached to the heat sink and one attached to
the moldcap as shown in Figure 7, Figure 8, and Figure 9. The recommended attach procedure is at
the end of this section.
Figure 7. Tape Layers
Figure 8. Attaching the Tape to the Package and Heat Sink
Foil
Clear Liner
Non-transparent Liner
Acrylic Adhesive
Silicone Adhesive
Actual Appearance:
Acrylic side appears white,
Silicone side appears silver (foil)
when liners are removed.
Tape:
~ 1"x1” Sq.
Heat
Sink
Tape: May be
larger than applied
to moldcap or pre-
applied by
manufacturer
Moldcap
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