Intel740™ Graphics Accelerator Thermal Design Considerations
16 Application Note 653
Note: Silicone Adhesive always joins to either the heat sink or the moldcap, the Acrylic Adhesive sides
must join to each other (Figure 9).
Note: As every motherboard, system and heat sink combination may introduce variance in attach
strength, it is generally recommended that the user carefully evaluate the reliability of tape attaches
prior to using in high volume.
For the Tape described in Appendix A, “Sources,” the recommended two-piece attach procedure is
as follows:
1. Ensure that the surface of the component and heat sink are free from contamination. Use a
clean, lint-free wipe, proper safety precautions and Isopropyl Alcohol to ensure cleanliness.
2. Cut tape to size. Suggestions for the appropriate size can be seen in Figure 8.
3. Heat Sink Side: Remove the non-transparent liner. You will see foil underneath (Figure 7).
Apply the tape to the center of the heat sink and smooth over the entire surface using moderate
pressure. There should be no air bubbles under the tape.
4. Component Side: Remove the non-transparent liner. You will see foil underneath (Figure 7).
Apply the tape to the center of the mold cap and smooth over the entire surface using moderate
pressure. There should be no air bubbles under the tape.
5. Both Sides: Remove the clear liners from each side, center the heat sink over the component
and apply using any one of the manufacturer’s recommended temperature/pressure options
shown in Table 3.
Figure 9. Completing the Attach Process
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