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Intel 740 User Manual
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Revision 0.91
7
SO-DIMM
Modul
e — Unbuff
ered SDRA
M/SGRAM
Graphics
Figure 4.
256K/512K x
32 SGRAM
SO-DIM
M Block Diagram (1 bank of one 256K/
512K x 3
2)
DQM0
DQ[7:0]
DQM1
DQ[15:8]
DQM2
DQ[23:16]
DQM3
DQ[31:24]
512Kx32
Or
256Kx32
SGRAM
D0
CS
CS0
SCL
VSS
SBA
A2
A1
A0
CLK0
D0
Serial
PD
(optional)
SDA
CKE
D0
D0
/RAS
/CAS
D0
D0
/WE
DSF
D0
D0
A[10:0]
VCC
VSS
D0
D0
Three bypass capacitors per
SGRAM device (refer to
component section).
A003.vsd
226
228
Table of Contents
Table of Contents
3
Revision History
8
Introduction
9
About this Design Guide
11
References
12
Addin Card Design
15
Introduction
15
Design Features
16
Intel740™ Graphics Accelerator
16
MIX and Match Options for Intel740™ Graphics Accelerator Card
16
BT829B - Video Decoder
17
BT869 - TV Encoder
17
Terminology
17
Power Sources
17
Intel740™ Graphics Accelerator Power Supplies
17
Fences
18
Stitching
18
Example of Power Plane Separation ("Fencing")
18
Example of Power Plane Stitching
18
Major Signal Sections
19
Board Description
20
Layout and Routing Guidelines
19
Placement
19
Example ATX Layout
20
Four Layer Board Stack-Up
21
BGA Component
22
Layout Requirements
22
Metal Defined Land Dimensions
22
BGA Trace
22
Ground Connections
23
Power Connections
23
Dogbone Via Pattern
23
Decoupling
24
Suggested VCC Planes for the Intel740™ Graphics Accelerator
24
Intel740™ Graphics Accelerator Decoupling
24
General Signal Routing
25
Voltage Regulator
25
Bt829 Video Decoder
25
Intel740™ Graphics Accelerator BGA Routing Example
25
Ground Planes
26
Power Planes
26
Passive Components and Signal Routing
26
Bt869 Video Encoder
26
Bt829B GND and AGND Pins
26
Bt829B VCC and AVCC Pins
26
Power Planes
27
Passive Components and Signal Routing
27
AGP Layout and Routing Guidelines
27
Bt869 Digital and Analog Power Pins
27
AGP Signal Lengths
27
Strobes and Corresponding Signal Groups
27
Intel740™ Graphics Accelerator Memory Layout and Routing Guidelines
28
Supported Memory Options
28
Memory Layout Restrictions (See Figure 2-12 and Figure 2-13)
28
Memory Layout Restrictions (See Figure 2-14 and Figure 2-15)
29
Layout Dimensions (MA[11:0])
29
Layout Dimensions (MD[63:0], DQM[7:0])
29
Layout Dimensions (WEA#, SRASA#, SCASA#, CSA1#, CSB0#)
29
Memory Layout Restrictions (See Figure 2-16 and Figure 2-17)
30
Intel740™ Graphics Accelerator Memory Configurations
31
Layout Dimensions (WEB#, SRASB#, SCASB#, CSA0#)
30
Memory Layout Dimensions (TCLK0)
30
Memory Layout Dimensions (TCLK1)
30
Memory Layout Dimensions (RCLK and OCLK to RCLK)
31
MB Local Memory Connection (64-Bit Data Path)
31
TV out Interface
34
Analog Signals
34
UL and FCC Considerations
34
TV Out/Roma Trace Lengths (See Figure 2-22)
34
Layout Dimensions, Digital TV Bus
34
GPIO Functions
35
Addin Card Schematics
35
512Kx32 and 256Kx32 Pinout Compatibility
38
Device AGP Motherboard Design
59
Introduction
59
Overview
59
About this Chapter
60
Block Diagram
60
Implementation Issues
61
Disabling a Master Device
61
Low Power Logic Implementation
62
State of Signals to be Driven after System Reset but at Least One Clock Prior to Asserting TEST
62
GPO27# and GPO28# Signal Duration
63
The Schematic Diagram for GPO27#, PCIRST# (System Reset), RESET#, ROMA16 Signals
62
Signal Duration of the GPO Signals from PIIX4
63
State Diagrams
64
The Schematic Diagram for the WEB#, SCASB#, SRASB#, CS0B#, CS1B# and TEST
63
Intel740™ Graphics Controller (on Board Device) Remains in Low Power Mode
64
Intel740™ Graphics Controller (on Board Device) State Diagram
64
Signal Quality and Timing Issues
65
Strobe Edge Quality Issues
65
Clock Issues
66
Point-To-Point Topology
66
Design Recommendations
67
General Design Recommendation
67
Voltage Definitions
67
Device AGP Motherboard Layout and Routing Guidelines
67
BGA Quadrant Assignment
68
Major Signal Sections
68
Example ATX Placement for a up Pentium
69
Intel ® 440BX Agpset / Intel 740 Graphics Accelerator Design
69
Board Description
70
3-Point AGP Design Guidelines
70
Layout and Routing
70
Four Layer Board Stack-Up
70
Data and Strobe Definitions
71
Data and Associated Strobe
71
Assumptions for Board Design Guidelines
72
Add-In Card Guideline Assumptions
72
Motherboard Guideline Assumptions
72
Data Signal and Strobe Guideline Assumptions
72
Control and Clock Signal Guideline Assumptions
72
Data Signal and Strobe Requirements
72
Control Signal Line Length Requirements
73
3-Load AGP Topology
74
Overall Solution Space
74
Point-To-Point Topology
73
Strobe and Data Segment Solution Space
74
Device Data Load Topology
74
Device Strobe Load Topology
74
Device Data Load Topology (Solution 1 Is Shown)
75
Device Strobe Load Topology (Solution 1 Is Shown)
75
Clock Topology and Matching
75
Intel740™ Graphics Accelerator Memory Layout and Routing Guidelines
76
Clock Segment Solution Space
76
Supported Memory Options
76
Memory Layout Restrictions (See Figure 3-16 and Figure 3-17)
77
Memory Layout Restrictions (See Table 3-16 and Table 3-17)
77
Layout Dimensions (MA[11:0])
77
Layout Dimensions (MD[63:0], DQM[7:0])
77
Memory Layout Restrictions (See Figure 3-19)
78
Device AGP Intel740™ Graphics Accelerator Memory Configurations
79
Layout Dimensions (WEA#, SRASA#, SCASA#, CSA0#)
78
Memory Layout Dimensions (TCLK1)
78
Memory Layout Dimensions (RCLK and OCLK to RCLK)
79
Pentium
80
Device AGP Motherboard Reference Design Schematics
80
512Kx32 and 256Kx32 Pinout Compatibility
84
DIMM Socket
95
Usb Connectors
106
Thermal Considerations
128
Thermal Design Considerations Chart
130
Mechanical Information
132
Mounting Hole Locations (Fan/Heatsink Assembly)
134
Board Dimensions
134
Fan/Heatsink Hole Pattern
134
DVD Daughter Card Dimensions (ATX and NLX)-Top Side
135
VMI Header Placement
135
Pin Video Connector Schematic
136
Pin Video Connector
136
Recommended Bracket Placement
137
Recommended Bracket Cutout
137
Bracket
137
NLX Considerations
138
Third Party Vendors
140
Voltage Regulator
142
50 Pin Connector
142
Fan/Heatsink
142
Flash Components
142
Video Encoders/Decoders
142
DVD Daughter Cards
143
TV Tuner
143
Application Note 653: Thermal Design Considerations
146
Table of Contents
147
Document Goals
149
Importance of Thermal Management
149
Introduction
149
Intel740™ Graphics Accelerator Packaging Terminology
150
Case Temperature
151
Thermal Specifications
151
Power
152
Airflow Management
153
Designing for Thermal Performance
153
Cooling Solutions
155
System Fans
155
Fan Placement
155
Fan Direction
157
Size and Quantity
157
Fan Venting
157
Vent Placement
157
Vent Area/Size
157
Vent Shape
158
Ducting
158
Ducting Placement
158
Thermal Enhancements
158
Clearance
158
Low Profile Fan Heat Sink
159
Low Profile Fan Heat Sink PCB Layout Guidelines
159
Low Profile Fan Heat Sink Electrical Requirements
160
Low Profile Fan Heat Sink Attach
161
Low Profile Fan Heat Sink Reliability
161
Low Profile Passive Heat Sink
162
Clip Attach
162
Epoxy
162
Tape Attach
163
Reliability
165
Thermal Interface Management for Heat Sink Solutions
165
Bond Line Management
166
Interface Material Performance
166
Case Temperature Measurements
167
Measurements for Thermal Specifications
167
Power Simulation Software
168
Conclusion
170
Attach Sales Locations
171
Low Profile Fan Heat Sink Sales Locations
171
Low Profile Passive Heat Sink Sales Locations
171
Sources
171
Table of Contents
177
Contents
179
Introduction
179
Low Power Mode Overview
179
State Diagrams
180
Supported Single Monitor and Mulitmonitor Configurations
182
Figures
182
Software Sequence
182
Low Power Mode
182
Tables
182
Monitor and Mulitmonitor Configurations
182
Table of Contents
189
1 Introduction
191
Convention Used
191
Objective
191
Scope of this Document
191
2 Pinout
192
Pin Functional Descriptions (Simplified)
194
3 Control Registers
195
Mode Register and Modes Required to be Supported
195
Special Mode Register
195
Color Register
196
4 Command Truth Table
197
5 Operative Command Table
198
6 Row/Column Addressing Per Memory Size/# Banks
203
7 Functional Description
204
Initialization Sequence
204
Power up Sequence
204
NOP and Device Deselect
205
Precharge All
205
Precharge Selected Bank
205
Read Bank
205
Row Activate
205
Write Bank
205
Block Write
206
Mode Register Set
206
Power down Mode
207
8 Essential Functionality for the "PC SGRAM" Device
208
Burst Read and Burst Write
208
Multi- Bank Ping Pong Access
208
Precharge Command after a Burst Read
208
Read and Write with Autoprecharge
208
Precharge Command after a Burst Write
209
Precharge Termination of a Burst Read
209
Precharge Termination of a Burst Write
209
Read Terminated by Read
209
Read Terminated by Write
209
Write Terminated by Read
209
Write Terminated by Write
209
Auto Refresh (CBR) Command
210
Back to Back Command Support
210
9 SGRAM AC/DC Parameters
211
DC Specifications for 100-166 Mhz
211
Specifications for 100-166 Mhz
211
A.C. Timing Parameters for 100-166 Mhz
212
A.C. Specifications for 166-250 Mhz
213
A.C. Timing Parameters for 166-250 Mhz
213
DC Specifications for 166-250 Mhz
213
IBIS: I/V Characteristics for Input and Output Buffers
214
IBIS Reference
215
Table of Contents
219
General Features
221
Labeling
221
Unbuffered Graphics SO-DIMM Module
221
Mechanical Outline
222
Environmental Requirements
223
Pin Assignments
224
Graphics SO-DIMM Block Diagram
225
Address Translation
229
Configuration
229
Default Parameters
229
Clock Frequency and Memory Timing
231
Resistor Strapping Options
231
Serial Presence Detect EEPROM
231
15 Ns Timing
232
Electrical Characteristics
232
10 Ns Timing
233
Timing Diagrams
234
PCB Layout Considerations
236
Clock Routing and Chip Selects
237
Address/Control Routing
238
Data Routing
239
Electrical Specifications
241
Operating Requirements
241
Sdram/Sgram Components D.C. Operating Requirements
241
Memory Timing
242
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Intel 740 Specifications
General
Brand
Intel
Model
740
Category
Video Card
Language
English
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