OpAL Oxford Instruments Plasma Technology System Manual
Installation and Commissioning
Issue 8: July 10 Page 4-8 of 8 Printed: 14 July 2010 08:27
A rotameter is used to set and read the flow. A flow switch monitors the purge. The
process gases are turned off by means of a hardware interlock if the flow switch reports
low flow below 7.5slpm.
Deposition processes – pyrophoric gases
Tools that use silane to deposit thin films containing silicon shall be purged with
sufficient gas to bring the exhaust to one third of the lower explosion limit.
A rotameter is used to set and read the flow. A flow switch monitors the purge. For low
rate processes (<25sccm SiH
4
) the process gases are turned off by means of a hardware
interlock if the flow switch reports low flow below 5.2slpm. For high rate processes
(<50sccm Si H
4
) the process gases are turned off by means of a hardware interlock if the
flow switch reports low flow below 10.5slpm.
To Next Page
