System Manual= lñÑçêÇ=fåëíêìãÉåíë=mä~ëã~=qÉÅÜåçäçÖó= lé^i
PKP mêçÅÉëë=íêçìÄäÉëÜççíáåÖ=
PKPKN m~êíá~ä=éêçÅÉëë=Ñ~áäìêÉ=
PKPKNKN bñ~ãéäÉ=éêçÄäÉãë=
• Deposition rate has dropped
• Non-uniform deposition
PKPKNKO qóéáÅ~ä=Å~ìëÉë=
• Precursor source pot is empty
• Blockage in the delivery line. Follow H&S procedure
• Showerhead plate is clogged
• Chamber leak – Check leak-up rate
• Faulty MFC – check partial pressures
• Check MFCs / Pumps
• RF generator/matching – adjust matching unit set-up, check generator range switch, watch HF
matching time in mixed frequency pulsed process
• Incorrect gases used
• Temperature – cooling or heater failure
• Chamber is dirty – needs more frequent cleaning
• Incorrect process regime (knife-edge process)
• Wrong process for given hardware - no pumpdown time, no preheat step, no pre-clean step
PKPKO qçí~ä=éä~ëã~=Ñ~áäìêÉ=
PKPKOKN bñ~ãéäÉ=éêçÄäÉãë=
• Plasma does not ignite/light up
• Plasma is unstable/pulsing
• Plasma is flickering
PKPKOKO qóéáÅ~ä=Å~ìëÉë=
Check that readbacks are within tolerance – MFCs, pressure control, RF matching, temperature.
Check that base pressure has been reached (this can always be changed if you are in a hurry!)
Read error / warning / information messages
Check that plasma is striking
Try selecting ‘ignore tolerance’ checkbox
Sudden pressure rise – check for dissociation, - try Ar instead, strike at reduced ICP power
Process Information (Information contained in this document is confidential)
Printed: 08 October 2007 11:00 Page 9 of 14 Issue 1: August 07
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