Rockwell Automation Publication 2094-UM001D-EN-P - May 2010 31
Planning the Kinetix 6000 Drive System Installation Chapter 2
Electrical Noise Reduction
This section outlines best practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 6000 system installations. For more
information on the concept of high-frequency (HF) bonding, the ground plane
principle, and electrical noise reduction, refer to the System Design for Control
of Electrical Noise Reference Manual, publication GMC-RM001
.
Bonding Modules
Bonding is the practice of connecting metal chassis, assemblies, frames, shields,
and enclosures to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To achieve
a good bond between power rail and the subpanel, surfaces need to be paint-free
or plated. Bonding metal surfaces creates a low-impedance return path for
high-frequency energy.
Improper bonding of metal surfaces blocks the direct return path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive
high-frequency energy can effect the operation of other microprocessor
controlled equipment.
To improve the bond between the power rail and subpanel, construct your
subpanel out of zinc plated (paint-free) steel.
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