Installing HiPath 3000 Nur für den internen Gebrauch
A31003-H3590-S100-7-7620, 06/2012
4-14 HiPath 3000/5000 V9, Service documentation
inst_h3.fm
Installing HiPath 3800
4.1.3.4 Grounding the System
Ground the system as described.
4.1.3.4.1 Not for U.S.: Grounding the System
Grounding: Grounding options
Implementation guidelines in accordance with IEC 60364 and IEC 60950-1 must be adhered
to during installation.
The illustrations starting with Figure 4-6 show different grounding options.
Note on possible ground loops
7
Danger
Each HiPath 3800 system cabinet and all external main distribution frames (for ex-
ample, MDFU-E) must be grounded as shown in Figure 4-5 by a separate ground
conductor (minimum cross-section = 2.5 mm
2
). Make sure that the ground conductor
is securely installed and strain-relieved.
If external factors can impact on the ground conductor and if protected installation is
not possible, the ground conductor must have a minimum cross-section of 4 mm
2
.
Failure to follow these instructions can result in electrical shock.
7
Danger
If your personnel are not qualified to work on the low-voltage network (230 Vac), you
must hire a licensed electrician to ground the system separately using option 1b
(Figure 4-7). The Section 1.6.1, “Connection to the Power Circuit” is to be adhered
to.
>
To avoid ground loops from remotely operated devices (V.24 system peripherals),
the devices should be connected to the same low-voltage network (sub-distribution
board) if possible.
If the building floor plan does not permit this, you may need a line driver to isolate
the external devices in the event of a malfunction.
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