Microsemi IGLOO2 - Figure 88 Stack-Up Used in Development Board

Appendix: Stack-Up
AC393 Application Note Revision 14.0 92
Figure 88 • Stack-up Used in Development Board
Thickness and Tolerance:
Cu+: Lamination/PrePreg:
Base Material Requirements:
Type: Description:
Lamination Stack-up:
L#/Type: Description:
Target Post-Lam Thickness: 0.0600 +/- 0.0030
Stack-up Notes:
Copper Oz Legend: H = 1/2 Oz T = 3/8 Oz Q = 1/4 Oz S = 1/16 Oz
0.004 Q/H CORES MUST BE MADE OF (1 x 2116 PREG)
0.0035 H/H CORES MUST BE MADE OF (1 x 2113 PREG)
0.003 1/H CORES MUST BE MADE OF (1 x 1080 PREG)
1 Mix
2 Pin
3 Mix
4 Pin
5 Mix
6 Pin
7 Mix
8 Pin
9 Mix
10 Pin
11 Mix
12 Pin
13 Mix
14 Pin
15 Mix
16 Pin
Core 0.0040 Q/H
Pre-Preg (1 x 2113)
Pre-Preg (1 x 2113)
Pre-Preg (1 x 1080)
Pre-Preg (1 x 1080)
Pre-Preg (1 x 1080)
Pre-Preg (1 x 2113)
Pre-Preg (1 x 2113)
Core 0.0035 H/H
Core 0.0035 H/H
Core 0.0030 1/H
.00035
.00060
.00060
.00060
.00060
.00060
.00060
.00060
.00060
.00035
.00060
.00060
.00120
.00120
.00060
.00060
.0040
.0034
.0035
.0034
.0035
.0034
.0035
.0034
.0040
.0023
.0035
.0022
.0030
.0030
.0026
Core 0.0030 H/1
Core 0.0035 H/H
Core 0.0035 H/H
Core 0.0040 H/Q
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
NP 4000-13EP
+/- 0.0003
+/- 0.0002
+/- 0.0003
+/- 0.0002
+/- 0.0003
+/- 0.0003