TAJIMA TWMX-C - Sequin Device IV

To set details of optional device
204
Chapter 8
2-2. Sequin device IV
The detail of the device will be set.
2-2-1. Screen
[a] Feed amount of sequin chips of device at left side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[b] Feed amount of sequin chips of the device at the right side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[c] Insertion of jump data when a sequin chip is sewn on
Select "YES" when sequin chips are not sewn effectually. However, productivity will be
decreased.
YES: To perform
NO: Not to perform
[d] Moving up of device at frame stepping
YES: To perform
NO: Not to perform
[e] Feed out the sequin chip one by one manually.(→p.203)
The feed amount is the value selected at [a] or [b] described above.
L: Left device
R: Right device
Selecting "NO" will increase manufacturing efficiency. However, the device
could interfere with the frame resulting in its breakage depending on design or
frame type to use.
F3
2 Sequin
NO
YES/NO
Jump Insertion
YES
Device Up at
YES/NO
4.0
4.0
Sequin (L)
Sequin (R)
[mm]
2.0 23.0
[mm]
2.0 23.0
[a]
[b]
[c]
[d]
Sequin chip
feed
[e]
frame stepping
CAUTION
!