Epson S1D13706 - Pinout Diagram - die Form; Figure 4-3: Pinout Diagram - die Form (S1 D13706 D00 A)

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Epson Research and Development
Vancouver Design Center
S1D13706 Hardware Functional Specification
X31B-A-001-08 Issue Date: 01/11/13
4.3 Pinout Diagram - Die Form
Figure 4-3: Pinout Diagram - Die Form (S1D13706D00A)
Chip Size: 5.88 x 6.55 mm
PAD size: 68 x 68
µ
m
Unusable Pad
Unusable Pad
DIE No. X5534D
15 10 403530252015
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120125130135140145150155160165170
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