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Epson Research and Development
Vancouver Design Center
S1D13706 Interfacing to the Motorola MCF5307 "ColdFire" Microprocessor
X31B-G-010-02 Issue Date: 01/02/23
caches from program or data memory. They are typically not used for transfers to or from
IO peripheral devices such as the S1D13706. The MCF5307 chip selects provide a
mechanism to disable burst accesses for peripheral devices which are not burst capable.
2.2 Chip-Select Module
In addition to generating eight independent chip-select outputs, the MCF5307 Chip Select
Module can generate active-low Output Enable (OE
) and Write Enable (BWE) signals
compatible with most memory and x86-style peripherals. The MCF5307 bus controller also
provides a Read/Write (R/W
) signal which is compatible with most 68K peripherals.
Chip selects 0 and 1 can be programmed independently to respond to any base address and
block size. Chip select 0 can be active immediately after reset, and is typically used to
control a boot ROM. Chip select 1 is likewise typically used to control a large static or
dynamic RAM block.
Chip selects 2 through 7 have fixed block sizes of 2M bytes each. Each has a unique, fixed
offset from a common, programmable starting address. These chip selects are well-suited
to typical IO addressing requirements.
Each chip select may be individually programmed for:
• port size (8/16/32-bit).
• up to 15 wait states or external acknowledge.
• address space type.
• burst or non-burst cycle support.
• write protect.
Figure 2-3: “Chip Select Module Outputs Timing” illustrates a typical cycle for a memory
mapped device using the GPCM of the Power PC.
Figure 2-3: Chip Select Module Outputs Timing
CLK
CS[7:0]
BE/BWE[3:0]
OE
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