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GE P742

GE P742
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P74
x/EN SG/Na7
Symbols and Glossary
(SG) 14
-
6
MiCOM P74
1, P742, P743
SG
Symbols Explanation
R
A resistance.
R Gnd. A distance zone resistive reach setting:
Used for ground (earth) faults.
RBN
Lead burden for the neutral.
RBPh
Lead burden for the phases.
RCA Abbreviation of “Relay Characteristic Angle”:
The centre of the directional characteristic.
RCT
Current Transformer secondary resistance.
REF
Restricted earth fault protection.
Rev.
Indicates an element responding to a flow in the “reverse” direction.
RMS The equivalent a.c. current:
Taking into account the fundamental, plus the equivalent heating effect of any
harmonics. Abbreviation of “root mean square”.
RP Abbreviation of “Rear Port”:
The communication ports on the rear of the relay.
RSTP
Rapid Spanning Tree Protocol
Rx Abbreviation of “Receive”:
Typically used to indicate a communication receive line/pin.
S1 Used in IEC terminology to identify the secondary CT terminal polarity:
Replace by a dot when using ANSI standards.
S2 Used in IEC terminology to identify the secondary CT terminal polarity:
The non-dot terminal.
SCL
Substation Configuration Language:
In IEC 61850, the definition of the configuration files.
SCSM
Specific Communication Service Mappings:
In IEC 61850, the SCSMs define the actual information exchange mechanisms
currently used (e.g. MMS).
SDEF
Sensitive Differential Earth Fault Protection.
SEF
Sensitive Earth Fault Protection.
SHP
Self Healing Protocol
SSD
Solid State Device
T
A time delay.
TCS
Trip circuit supervision.
TD The time dial multiplier setting:
Applied to inverse-time curves (ANSI/IEEE).
TE A standard for measuring the width of a relay case:
One inch = 5TE units.
TMS
The time multiplier setting applied to inverse-time curves (IEC).
Tx Abbreviation of “Transmit”:
Typically used to indicate a communication transmit line/pin.
V
Voltage.
V<
An undervoltage element.

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