Remove the Motherboard Assembly
b.
Extend the server into the maintenance position.
See “Extend the Server to the Maintenance Position” on page 62.
c.
Attach an antistatic wrist strap to your wrist, and then to a metal area of the
chassis.
See “Take Antistatic Measures” on page 65.
d.
Remove the server top cover.
See “Remove the Server Top Cover” on page 65.
2.
If present, remove the Oracle Storage 12 Gb SAS PCIe RAID HBA, Internal card
and its associated super capacitor.
See “Remove the Internal HBA Card and HBA Super Capacitor” on page 182.
Note - After you remove the HBA super capacitor, remove the HBA super capacitor tray by
squeezing the plastic hinges together and lifting the tray from the chassis.
3.
Remove the following reusable components:
Caution - During the motherboard removal procedure, it is important to label power supplies
with the slot numbers from which they were removed (PS0, PS1). This is required because the
power supplies must be reinstalled into the slots from which they were removed; otherwise, the
server key identity properties (KIP) data might be lost. When a server requires service, the KIP
is used by Oracle to verify that the warranty on the server has not expired. For more information
on KIP, see “FRU Key Identity Properties (KIP) Automated Update” on page 53.
■
Fan modules
See “Remove a Fan Module” on page 85.
■
Fan tray
See “Remove the Fan Tray” on page 89.
■
Air baffle
See “Remove the Air Baffle” on page 113.
■
PCIe cards
See “Remove a PCIe Card” on page 135.
■
SAS storage drive cables (if present)
See “Remove SAS Storage Drive Cables” on page 189.
■
NVMe cables (if present)
204 Oracle Server X8-2L Service Manual • January 2021
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