Renesas H8 Series Hardware Manual

Section 1 Overview
Rev. 7.00 Mar 10, 2005 page 13 of 652
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81 79 77 75 73 71 69 67 65 63
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80 78 76 74 72 70 68 66 64 62
25 27 29 31 33 35 37 39 41
24 26 28 30 32 34 36 38 40
Chip size: 3.99 mm × 3.99 mm
Voltage level on the back of the chip: GND
Type code
Figure 1.5 Bonding Pad Location Diagram of HCD64338024, HCD64338023,
HCD64338022, HCD64338021, and HCD64338020 (Top View)

Renesas H8 Series Specifications

General

Brand	Renesas
Model	H8 Series
Category	Computer Hardware
Language	English